I have a question about reflow profile of BGA components.
As I measured the temperature on several places of a BGA component , I found there were differences on temeprature of the case and the balls of the BGA.
I need to asure good reflow , meaning all the balls get strong metal connection with the pad after reflow, so I want to activate the max temperature on the reflow proccess. on the other hand of course, I definitely on't want to damage the component, so how can I know what min temperature I need to aplly on the balls so they melt the best?
I saw in all Altera's documents that max temperature of 220 c on case is recommended, but found no refering to balls max temperature, or min temperature above the reflow temp.
Thank you very much for your answer.